发明名称 |
SHIELDED STACKED INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of a shielded stacked integrated circuit packaging system includes forming a first integrated circuit structure having a first substrate and a first integrated circuit die; mounting a shield over the first substrate and the first integrated circuit die; mounting a second integrated circuit structure having a second substrate and a second integrated circuit die over the shield; and forming a package encapsulation for covering the first integrated circuit die, the shield, and the second integrated circuit structure.
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申请公布号 |
US2009194853(A1) |
申请公布日期 |
2009.08.06 |
申请号 |
US20090423320 |
申请日期 |
2009.04.14 |
申请人 |
JANG KI YOUN;KIM YOUNGMIN;JEON HYUNG JUN |
发明人 |
JANG KI YOUN;KIM YOUNGMIN;JEON HYUNG JUN |
分类号 |
H01L23/552;H01L21/56 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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