RESIN COMPOSITION AND MULTILAYER RESIN FILM EMPLOYING THE SAME

摘要

Disclosed are a resin composition in which the UV laser processability of the resin is improved, and which not only can be employed as an electronic material such as an insulating film of a build-up substrate, but also to fabricate a circuit substrate in which the electrical insulating properties do not degrade, and a multilayer resin film employing the same. This resin composition contains a thermocurable resin (A), a curing agent (B), silica (C ), an ultraviolet light absorbing agent (D) and a solvent (E), wherein the ultraviolet light absorbing agent (D) is contained in an amount of 0.5 to 50 weight parts relative to the total amount of thermocurable resin (A), curing agent (B) and ultraviolet light absorbing agent (D), and the solvent (E) is contained in an amount of 20 to 500 weight parts relative to a total 100 weight parts of thermocurable resin (A) and curing agent (B). The multilayer resin film is fabricated from sheets of the resin composition laminated on a substrate, wherein the sheets of the resin composition on the substrate are dried, and the solvent is contained in an amount of 0.01 to 5 weight parts relative to the total resin composition.