发明名称 LOW-PROFILE PIEZOELECTRIC SPEAKER ASSEMBLY
摘要 <p>A low-profile speaker assembly comprises a substrate (310) and a substantially plan piezoelectric element (300, 500) disposed in a plane substantially parallel to the substrate (310) and mechanically connected to the substrate (310) at one or more edges. A tuning mass (330, 550) is attached to a face of the piezoelectric element (300, 500), to improve low-frequency performance of the speaker assembly. In some embodiments, the tuning mass (330, 550) is disposed on the surface of the piezoelectric element (300, 500) facing the substrate (310). The substrate (310), which may comprise a printed circuit board, may include a cut-out region (315) arranged to allow movement of the tuning mass (330, 550) within the cut-out region (315).</p>
申请公布号 WO2009097012(A1) 申请公布日期 2009.08.06
申请号 WO2008US73445 申请日期 2008.08.18
申请人 SONY ERICSSON MOBILE COMMUNICATIONS AB;EATON, WILLIAM CHRIS 发明人 EATON, WILLIAM CHRIS
分类号 H04R17/00 主分类号 H04R17/00
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