| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the warpage of a substrate due to heat generating during light emission and relax a drop of heat dissipation efficiency. <P>SOLUTION: A light-emitting module includes a substrate 10, a plurality of light emitting parts 19 which are mounted like a lattice to the substrate 10, and a heat sink 14 as a radiation means. The light emitting parts 19 have light-emitting elements 12 such as a light emitting diode, for example. A power supply part 13 is provided in the substrate 10. Circuits consisting of wiring layers 24 are formed in the substrate 10, and they electrically connect the light-emitting elements 12 with the power supply part 13. A fitting hole 11 is formed in the substrate 10. The heat sink 14 is fastened with the fitting hole 11 by screws 15 as a fitting member, thereby connecting the substrate 10 in close contact with the heat sink 14. In this manner, the external edge of the substrate 10 is not in contact with an external casing 18, and a space part 16 is formed around the external edge. <P>COPYRIGHT: (C)2009,JPO&INPIT |
