| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a photomask production method for producing a photomask capable of transferring a pattern with high positional accuracy onto a wafer. <P>SOLUTION: The photomask production method includes: a correction step of correcting a drawing device 4 and a position measuring device 3 so as to eliminate a positional variation amount of a pattern position caused by distortion of a photomask 11 when the photomask 11 is held on a mask stage of an exposure device 2; and a position measuring step, by the corrected position measuring device 3, of measuring a pattern position of a pattern drawn on a photomask 11 by the corrected drawing device 4. The method includes: calculating a displacement amount of the pattern drawn on the photomask 11 from a reference pattern position on the basis of the measurement result of the pattern position measured by the corrected position measuring device 3, and determining positional accuracy of the pattern drawn on the photomask 11 on the basis of the calculated displacement amount. <P>COPYRIGHT: (C)2009,JPO&INPIT |
