| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive composition which enables connection of a semiconductor device by means of a wire bonding method, using ultrasonic waves at normal temperature. <P>SOLUTION: The adhesive composition is used for bonding a semiconductor device on a semiconductor device support member, the semiconductor device having electrodes to be electrically connected by a wire bonding method using ultrasonic wave at normal temperature. The adhesive composition contains 0.01-1 wt.% resin beads made of (meth)acrylic resin having a number average particle size of 5-40 μm, and a compressive elastic modulus of 1-4 GPa. <P>COPYRIGHT: (C)2009,JPO&INPIT |
