发明名称 METHOD FOR BONDING RESIN BY LIGHT IRRADIATION, PROCESS FOR PRODUCING RESIN ARTICLE, RESIN ARTICLE PRODUCED USING THE SAME, METHOD FOR PRODUCING MICROCHIP, AND MICROCHIP PRODUCED USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for bonding resins to each other with high productivity at a temperature below a temperature necessary for bonding by heat sealing. <P>SOLUTION: The method for bonding resins to each other is a method for bonding a first resin 1 and a second resin 2 to each other. The method includes a step (I) of irradiating a space 10 containing oxygen molecules in contact with surfaces 3a, 3b of the first and second resins with vacuum ultraviolet light having a wavelength of not more than 175 nm, and a step (II) of raising the temperature in such a state that the surfaces 3a, 3b after the irradiation are in contact with each other, to bond the first resin 1 and the second resin 2 to each other using the surfaces 3a, 3b as bonding surfaces. In the step (I), the surfaces 3a, 3b of the first and second resins may be further irradiated with vacuum ultraviolet light. In this case, the light intensity of the vacuum ultraviolet light which reaches the surfaces 3a, 3b is preferably, for example, 0.1 to 10 J/cm2. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009173894(A) 申请公布日期 2009.08.06
申请号 JP20080325346 申请日期 2008.12.22
申请人 KYOTO UNIV;ALPS ELECTRIC CO LTD 发明人 SUGIMURA HIROYUKI;TANIGUCHI YOSHINAO;TAGUCHI YOSHIHIRO
分类号 C09J5/00;B29C65/02 主分类号 C09J5/00
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