发明名称 WAFER CARRIER DEVICE AND WAFER MACHINING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a wafer carrier device using a non-contact type suction holding means, which can surely carry, to a carrier destination, even the wafer of which the front surface is coated with a viscous protection member. SOLUTION: A carrier device 60 includes a carrier pad 70 including: a non-contact suction holding means 72 for holding a sucked wafer in a non-contact state; a supporting pad 73 formed of a fluororesin and used for regulating vertical movement of the wafer 1 in contact with one side of an outer circumferential part of the wafer 1; and a side face supporting means 74 for regulating horizontal movement of the water 1 in contact with an outer circumferential surface of the wafer 1. Further, the carrier device 60 includes a carrier mechanism 66 for moving the carrier pad 70 to a chuck table 20. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009177032(A) 申请公布日期 2009.08.06
申请号 JP20080015599 申请日期 2008.01.25
申请人 DISCO ABRASIVE SYST LTD 发明人 UEMURA SHINICHIRO
分类号 H01L21/677;H01L21/301 主分类号 H01L21/677
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