| 摘要 |
A substrate structure of a secure digital input/output module interface and its manufacturing method are disclosed herein. First, a substrate is provided, wherein the substrate has a plurality of conductive contact portions abreast arranged on a lower surface of the substrate. Next, a lead frame with a side rail and a plurality of fingers abrest arranged thereon is provided, wherein any one of those fingers has an internal contact and an external contact. Then, those internal contacts of those fingers are electrically connected to those conductive contact portions of the substrate. Further, a sigulation process and a molding process are provided to form a single structure of secure digital interface module. Those fingers of the lead frame are positioned one-on-one to those conductive contact portions of the substrate to improve the mechanical properties and reduce the size of the substrate.
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