SEMICONDUCTOR CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

A first wiring pattern is formed on the front surface of a first supporting plate; a semiconductor chip is disposed on the first wiring pattern; and the electrode terminal of the semiconductor chip and the necessary place of the first wiring pattern are connected electrically. A post electrode connected to a second wiring pattern of a post electrode component with wirings integrally connected by a second supporting plate is batch fixed at a predetermined position of the first wiring pattern formed on the first supporting plate and connected electrically. After resin sealing, the first and second supporting plates are peeled off; a glass substrate is stuck to the side of a front surface; and an external electrode to be connected to the second wiring pattern is formed on the side of rear surface.