发明名称 |
METHODS AND APPARATUS FOR CUTTING PROFILES |
摘要 |
An apparatus for cutting a profile, including: a cutter configured to make cuts on the profile having a first surface and a second surface, and having at least one rib on the first surface, wherein the cuts are made on the first surface of the profile; a first drive unit to drive the cutter forward and backward to and from the first surface of the profile; and a second drive unit to drive the cutter up and down along the first surface of the profile. |
申请公布号 |
WO2009061742(A3) |
申请公布日期 |
2009.08.06 |
申请号 |
WO2008US82371 |
申请日期 |
2008.11.04 |
申请人 |
SEOUL LASER DIEBOARD SYSTEM CO., LTD.;LEE, SANG MOO |
发明人 |
LEE, SANG MOO |
分类号 |
B21D5/00;B23D17/00;B23D17/04 |
主分类号 |
B21D5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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