| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To surely bond a wiring pattern of a substrate with a connection electrode of a bare chip. <P>SOLUTION: There is provided a method of manufacturing an electronic circuit element 15 including: an integrated circuit chip 6 having a plurality of connection electrodes 6a and a plurality of bumps 7 each provided on each electrode 6a; and a wiring board 5 having a plurality of wiring patterns 2 each provided to overlap each bump 7. The method includes: a chip mounting step of mounting the integrated circuit chip 6 on the wiring board 5 while putting a conductive paste 10 containing powdered tin and copper with a content of the copper of no more than 10 wt.% and no more than 70 wt.% between each bump 7 and each wiring pattern 2; and a bonding step of reflowing the bump 7 and the conductive paste 10 to bond each connection electrode 6a with each wiring pattern 2 via the bump 7 and the conductive paste 10. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
