| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a ceramic circuit board which has few short-circuits and bonding defects due to solder flow, a high operation reliability, and is easily mass-producible in a high yield. <P>SOLUTION: The process of manufacturing a ceramic board 1 which comprises bonding a plurality of 0.1-0.5 mm thick metal circuit plates 3 onto the surface of a ceramic substrate and integrally bonding components such as semiconductor devices 8 onto the surface of the metal circuit plates 3 via a solder layer 7 is provided with a step of forming projections 9 and 9a for preventing solder flows to the periphery adjacent to at least other metal circuit plates of the metal circuit plates 3, 3 in which the above components are solder bonded and a step of adjusting the height of the projections 9 and 9a in the range of 5-50μm and the width of the projections 9 and 9a in the range of 0.1-0.5 mm. Burrs themselves occurring in the periphery of a metal circuit plate, when a metal plate material is blanked by pressing to obtain a desired metal circuit plate, are utilized for the projections 9 and 9a as they are. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
