| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To miniaturize a radio communication module in which electronic parts are formed inside a multilayer substrate, by reducing sizes of the electronic parts. <P>SOLUTION: The radio communication module includes a substrate (140) in which a plurality of dielectric sheets are laminated, a bandpass filter (110) formed inside the multilayer substrate (140), a balun circuit (120) formed inside the multilayer substrate (140) and having an unbalanced element having an end coupled to the bandpass filter (110), and first and second matching circuits (130) formed inside the multilayer substrate (140) and coupled to ends of respective balanced elements of the balun circuit (120). At least one of the bandpass filter (110), the balun circuit (120), and the first and second matching circuits (130) includes a distributed constant element and is formed between the multilayer dielectric sheets of the substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
