摘要 |
<p>Disclosed is a method for electroconductive pattern formation, comprising (a) a step of forming a photocrosslinkable resin layer on a substrate with an electroconductive layer provided on a surface thereof, (b) a step of treating the photocrosslinkable resin layer with an aqueous alkali solution to reduce the thickness of the photocrosslinkable resin layer, (c) a circuit pattern exposure step, (d) a development step, and (e) an etching step, in that order, the aqueous alkali solution being an aqueous solution containing 5 to 20% by mass of an inorganic alkaline compound. Also disclosed is a method for electroconductive pattern formation, comprising (a') a step of forming a photocrosslinkable resin layer on a substrate having holes with an electroconductive layer provided on a surface thereof and the inside of the holes, (i) a step of curing only the photocrosslinkable resin layer present on the holes or the photocrosslinkable resin layer present on the holes and the peripheral part of the holes, (b') a step of treating an uncured part in the photocrosslinkable resin layer with an aqueous alkali solution to reduce the thickness of the uncured part of the photocrosslinkable resin layer, (c) a circuit pattern exposure step, (d) a development step, and (e) an etching step, in that order, the aqueous alkali solution being an aqueous solution containing 5 to 20% by mass of an inorganic alkaline compound.</p> |
申请人 |
MITSUBISHI PAPER MILLS LIMITED;IRISAWA, MUNETOSHI;TOYODA, YUJI;KANEDA, YASUO;NAKAGAWA, KUNIHIRO |
发明人 |
IRISAWA, MUNETOSHI;TOYODA, YUJI;KANEDA, YASUO;NAKAGAWA, KUNIHIRO |