发明名称 |
Anordnung, umfassend ein Trägersubstrat für Leistungsbauelemente und einen Kühlkörper sowie Verfahren zur Herstellung derselben |
摘要 |
In an arrangement composed of a substrate and a heat sink, the substrate is provided on a first side with at least one power component arranged on a first large-surface printed circuit trace and, on a second side opposite the power component, with a second large-surface printed circuit trace, which is connected in a thermally conductive manner to the first printed circuit trace via via holes. The substrate is mounted at the second side onto the heat sink in a thermally conductive manner, in order to achieve a good heat coupling of the substrate to the heat sink and the same time to avoid an undesirable electrical contact between the potential-carrying printed circuit traces and the heat sink. The substrate having spacer elements arranged on the second side is placed onto the heat sink and to hold it at a defined distance from the heat sink, the gap formed by the distance between the substrate and the heat sink being filled with a thermally conductive filler. |
申请公布号 |
DE19736962(B4) |
申请公布日期 |
2009.08.06 |
申请号 |
DE1997136962 |
申请日期 |
1997.08.25 |
申请人 |
ROBERT BOSCH GMBH |
发明人 |
WEBER, BERND;HOFSAESS, DIETMAR;BUTSCHKAU, WERNER;DITTRICH, THOMAS;SCHIEFER, PETER |
分类号 |
H01L23/36;H01L23/367;H01L23/42;H05K1/02;H05K3/00;H05K7/20 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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