发明名称 METHOD OF MANUFACTURING SUBSTRATE WITH CONDUCTIVE FILM
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate with a conductive film while giving high conductivity to the conductive film and high adhesion between a polyimide substrate and an inorganic oxide particulate film. <P>SOLUTION: The method of manufacturing the substrate 10 with the conductive film comprises (I) a step of applying dispersion solution containing TiO<SB>2</SB>particulates onto the surface of the polyimide substrate 12 and drying it to form a film 16 containing the TiO<SB>2</SB>particulates, (II) a step of applying conductive film forming ink containing hydrogenated metal particulates or metal particulates onto the surface of the film 16 containing the TiO<SB>2</SB>particulates to form a coat, and (III) a step of firing the coat to form the conductive film 14. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009176605(A) 申请公布日期 2009.08.06
申请号 JP20080015017 申请日期 2008.01.25
申请人 ASAHI GLASS CO LTD 发明人 NAKANISHI HIROSHI;HIRAKOSO HIDEYUKI;ABE KEISUKE
分类号 H01B13/00;B82Y30/00;B82Y99/00;C09D11/02;C09D11/03;C09D11/52;H05K3/10 主分类号 H01B13/00
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