| 摘要 |
PROBLEM TO BE SOLVED: To make a thickness of a wafer uniform after polishing work without complicating slurry control. SOLUTION: Slurry 5 including abrasive grains 5a of diamond is supplied from a slurry supply port 4 vertically penetrating a wafer support base rotating shaft 3 and a wafer support base 2 to a polishing surface 6a of a polishing plate 6. COPYRIGHT: (C)2009,JPO&INPIT |
