| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board in which a land need not to be changed in size even when lead-free solder is used, and the land is prevented from corroding, and solder peeling and land peeling can be suppressed, and to provide electronic apparatus using same. SOLUTION: On the circuit board 11, the land 114 is provided with eight via holes 12, a heat conductive film 13 and four solder materials 14. Each via hole 12 penetrates both surfaces of the land 114 through an insulating substrate 111. The diameter of each via hole 12 is set such that solder can not enter it. The heat conductive film 13 is formed on an internal wall of each via hole 12. The heat conductive film 13 connects both surfaces 114a and 114b of the land 114 through the insulating substrate 111. Each solder material 14 is provided entirely over an insertion-side surface 114a of a lead 120 at the land 114. COPYRIGHT: (C)2009,JPO&INPIT
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