ANNEALING APPARATUS

摘要

Disclosed is an annealing apparatus, which comprises heating sources (17a and 17b) disposed to face the face of a wafer (W) and having a plurality of LEDs (33) for emitting lights to the wafer (W), optically transmitting members (18a and 18b) for transmitting the lights from the light emitting elements (33), and cooling members (4a and 4b) made of Al and disposed to contact the heating sources (17a and 17b) directly. The heating sources (17a and 17b) comprise a plurality of light emitting element arrays (34) including a backing (32) made of AlN and having the LEDs (33) mounted by a sliver paste (56), and a thermal diffusion member (50) made of Cu and joined to the back side of the backing (32) with a solder (57). The light emitting element arrays (34) are fastened with screws to the cooling members (4a and 4b) through silicone grease (58).