| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding device which widens a bonding area with a simple mechanism, and has a high speed and high precision. <P>SOLUTION: The bonding device 10 includes a reference surface 11, a bonding arm 21 which rotates on a center 15 of rotation disposed apart from the reference surface 11, and allows a capillary 23 fitted at its tip to obliquely contact and leave the reference surface 11, a semiconductor chip 41, and an imaging apparatus 25 which optically detects a bonding position on a lead frame 12, the angle of an optical axis 51, extending from the reference surface 11 to the imaging apparatus 25, to the reference surface 11 being nearly equal to the angle between a movement line 35 of the tip of the capillary 23 and the reference surface 11. <P>COPYRIGHT: (C)2009,JPO&INPIT |
