POSITIVE PHOTOSENSITIVE RESIN PRECURSOR COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, AND ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a positive photosensitive resin precursor composition which is excellent in sensitivity and resolution and forms a patterned cured film, and also to provide a method for producing a patterned cured film, and electronic components.

SOLUTION: The positive photosensitive resin precursor composition contains: (a) a branched polymer having a structural unit represented by a general formula (1), and obtained by adding, in polymer synthesis, polycarboxylic acids or polycarboxylic acid derivatives having three or more carboxyl groups or three or more functional groups derived from carboxyl groups; (b) a compound crosslinking with the component (a) by heat, or polymerizing itself; and (c) a compound which generates an acid upon irradiation with actinic rays.

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