发明名称 FORMING METHOD OF COATED PATTERN AND FORMING METHOD OF PATTERN
摘要 PROBLEM TO BE SOLVED: To provide a forming method of a coated pattern capable of forming a coated pattern without using CVD, and a forming method of a high density pattern using the method. SOLUTION: After forming a coating film 3 by coating thermal polymerization composition on a thermally conductive substrate 1 having a pattern 2, a coated pattern 7 is formed by baking and developing. After forming an inorganic composition film on the coated pattern, a higher density pattern can be formed by etching. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009177060(A) 申请公布日期 2009.08.06
申请号 JP20080016198 申请日期 2008.01.28
申请人 TOKYO OHKA KOGYO CO LTD 发明人 IWAI TAKESHI;KUMADA SHINJI
分类号 H01L21/3205;H01L21/3065;H01L21/768 主分类号 H01L21/3205
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