发明名称 |
SUBSTRATE PROCESSING APPARATUS, MEMBER FOR HEAT TREATMENT AND METHOD OF MANUFACTURING MEMBER FOR HEAT TREATMENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus less likely to contaminate a substrate by metal elements externally diffusing from the surface of a member made of a silicon carbide provided inside a region for processing a substrate, and to provide a member for heat treatment and a method of manufacturing the member for heat treatment. SOLUTION: A heat treatment apparatus 10 has a support 30 which is the member made of the silicon carbide inside the region for processing the substrate 54. The support 30 is composed by changing a surface to a silicon oxide film 30d by oxidation and then removing the silicon oxide film 30d. The oxidation is executed under such a condition that the oxidation speed of the support 30 is higher than the diffusing speed inside the support 30 of the metal element included in the support 30. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009176861(A) |
申请公布日期 |
2009.08.06 |
申请号 |
JP20080012489 |
申请日期 |
2008.01.23 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC |
发明人 |
NAKAMURA IWAO;SASAJIMA RYOTA |
分类号 |
H01L21/31;C23C16/42;H01L21/22 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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