发明名称 SUBSTRATE PROCESSING APPARATUS, MEMBER FOR HEAT TREATMENT AND METHOD OF MANUFACTURING MEMBER FOR HEAT TREATMENT
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus less likely to contaminate a substrate by metal elements externally diffusing from the surface of a member made of a silicon carbide provided inside a region for processing a substrate, and to provide a member for heat treatment and a method of manufacturing the member for heat treatment. SOLUTION: A heat treatment apparatus 10 has a support 30 which is the member made of the silicon carbide inside the region for processing the substrate 54. The support 30 is composed by changing a surface to a silicon oxide film 30d by oxidation and then removing the silicon oxide film 30d. The oxidation is executed under such a condition that the oxidation speed of the support 30 is higher than the diffusing speed inside the support 30 of the metal element included in the support 30. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009176861(A) 申请公布日期 2009.08.06
申请号 JP20080012489 申请日期 2008.01.23
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 NAKAMURA IWAO;SASAJIMA RYOTA
分类号 H01L21/31;C23C16/42;H01L21/22 主分类号 H01L21/31
代理机构 代理人
主权项
地址