| 摘要 |
<p>A high heat dissipation LED light source module (1) includes a flip-chip LED light source and a high heat conduction insulating sheet (12). The flip-chip LED light source includes a heat dissipation base (112). The high heat conduction insulating sheet (12) is directly connected with the bottom surface of the heat dissipation base (112).The thermal conductivity of the insulating sheet (12) is between 170 and 237w/ (m OE). A high heat dissipation and high power LED light source assembly includes a connection board (2), a heat sink (3) and a plurality of LED light sources.</p> |
