| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of easily manufacturing a package in which a functional element is sealed with a protective substrate and excellent in moisture proof. <P>SOLUTION: A semiconductor device 10 comprising a semiconductor substrate 11 on which a functional element 12 is formed and a protective substrate 16 joined to the surface on the side on which the functional element 12 of the semiconductor substrate 11 is formed so as to have a first space 13 on the functional element part via adhesion layers 14a, 14b, wherein the adhesion layers 14a, 14b have second spaces 15 that surround the first space 13. Preferably, the adhesion layers 14a, 14b are formed of adhesion resin layers. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
