SOLID-STATE IMAGING DEVICE, METHOD OF MOUNTING THE SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SOLID-STATE IMAGING DEVICE, AND ELECTRONIC INFORMATION DEVICE

摘要

PROBLEM TO BE SOLVED: To attain a solid-state imaging device 100 of a mounting structure wherein an imaging element chip 2 is sealed within a sealing package 1 with a hollow space provided above a microlens 8, and corrosion or the like of element wiring is avoided within the sealing package with an excellent moisture resistance and a high reliability even when moisture enters the interior of the sealing package.

SOLUTION: In a solid-state imaging device 100 wherein an imaging element chip 2 is sealed within a sealing package 1 with a hollow space provided above a microlens 8, the inner surface of the sealing package 1, the surface of the imaging element chip 2, and the surfaces of bonding wires are completely covered with a protective film 4.

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