| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer printed board, capable of realizing cost reduction and making sure the reliable electrical connections among printed wires provided on different layers, and to provide a manufacturing method of the printed board. <P>SOLUTION: The multilayer printed board 10 comprises a single-sided printed board 11 and a single-sided printed board 12. The single-sided printed board 11 comprises a substrate 11a and a printed wire 11b, and the single-sided printed board 12 comprises a substrate 12a and a printed wire 12b. A communication hole 12f is further made at an appropriate position of the board 12. The single-sided printed boards 11 and 12 are layered, and the wires 11b and 12b are connected via the communication hole 12f. Solder Me is filled inside the communication hole 12f and deposited onto surfaces of both of the printed wire 11b and the printed wire 12b, and thereby, the wire 11b with the wire 12b is electrically connected. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
