| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin packaged semiconductor device which can control flowing of resin during molding without prolonging a development period or increasing initial cost even if the composition of mold content is changed and can ensure the quality of mold resin. <P>SOLUTION: The resin packaged semiconductor device 10 includes a lead frame 11 and a circuit board 12 arranged on the lead frame 11, and the lead frame 11 and the circuit board 12 are made integral and are packaged with resin. An opening 34 is made at the specified position in the lead frame 11. The circuit board 12 is formed of a resin substrate, and a through-hole 36 is formed at a position where it can be communicated with the opening 34 and a fluid resin for packaging can pass therethrough. Since the circuit board 12 is formed of a resin substrate, the through-hole 36 or the like can be easily formed. Therefore, flowing of resin can be changed during molding only by adjusting the dimension of the through-hole or the opening. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
