| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a multi-layer printed wiring board capable of preventing warping from occurring and attaining high density. <P>SOLUTION: Since via-holes 50, 70 and 90 are filled with a soldering material, an area of the interlayer resin insulating layer 60 disposed directly above the via-hole 50 of the lower interlayer resin insulating layer 40 can be made smooth. Thus, a conductor circuit 72 for connecting the via-hole 50 of the lower layer to the via-hole of the upper layer can be placed, at a position directly above the via-hole 50 which has been a dead space in a prior art, resulting in a high-density multi-layer printed wiring board. Moreover, since the via-holes 50, 70 and 90 are arranged in a crank shape, they are not localized. For this reason, the multi-layer printed wiring board 10 has property of preventing warpage from occurring therein, and superior mounting reliability in mounting IC chips, and the like, thereon. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
