发明名称 PREPREG, METHOD FOR PRODUCING IT, AND PRINTED WIRING BOARD USING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a prepreg wherein strong bonding strength works in the thickness direction to improve mechanical strength in folding and the like and heat conductivity is increased. <P>SOLUTION: The prepreg 11 is composed of a glass woven fabric 13 having aperture ratio of 50% or less and thickness of 10-300μm, and semicured resin body 14 with which the glass woven fabric 13 is impregnated. The semicured resin body 14 comprises a semicured resin, alumina dispersed in the resin body, and an inorganic filler 29 consisting of at least one kind or more selected from aluminum nitride, boron nitride, silicon carbide, silicon nitride, silica, zinc oxide, titanium oxide, tin oxide, zircon silicate, and magnesium oxide. The surface of the inorganic filler 29 is treated with at least one or more surface treatment agents 30 selected among phosphoric ester, carboxylic ester, and sulfonic ester. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009173726(A) 申请公布日期 2009.08.06
申请号 JP20080012266 申请日期 2008.01.23
申请人 PANASONIC CORP 发明人 KITAGAWA SHOYO;ASAHI TOSHIYUKI
分类号 C08J5/24;C08K9/04;H05K1/03;H05K3/46 主分类号 C08J5/24
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