发明名称 SOLDER BALL PRINTER
摘要 PROBLEM TO BE SOLVED: To provide a solder ball printer capable of efficiently and securely charging and printing solder balls to form bumps. SOLUTION: A solder ball printing system includes a flux printing unit 101 which prints flux on electrode pads of a substrate, a solder ball charging-printing unit 103 which supplies solder balls onto the electrode with the printed flux, and an inspection-repair unit 104 which inspects the state of the substrate where the solder balls are printed and makes a repair according to a defective state is provided. A flux inspection-repair unit 102, which inspects the state of the substrate with the printed flux and makes a repair according to a defective state, is provided between the flux printing unit 101 and the solder ball charging-printing unit 103; and the solder ball charging-printing unit 103 includes a screen 20 which supplies the solder balls and a printing means having a slit body for charging the solder balls in the screen 20. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009177015(A) 申请公布日期 2009.08.06
申请号 JP20080015215 申请日期 2008.01.25
申请人 HITACHI PLANT TECHNOLOGIES LTD 发明人 HONMA MAKOTO;MUKAI NORIAKI;KAWABE SHINICHIRO;IGARASHI AKIO
分类号 H01L21/60;B23K1/00;B23K3/00;B23K3/06;B23K101/42;H05K3/34 主分类号 H01L21/60
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