SILICEOUS POWDER, PROCESS FOR PRODUCTION OF THE SAME, AND USE THEREOF

摘要

The invention provides a siliceous powder suitable for the preparation of semiconductor-encapsulating materials and a process for the production of the powder. A siliceous powder exhibiting a Freudlich adsorption constant (K) of 1.3 to 5.0 for pyridine, particularly preferably, such a siliceous powder wherein the total content of SiO2, Al2O3, and B2O3 is 99.5mass% or above (in terms of oxide) and the total content of Al2O3 and B2O3 is 0.1 to 20mass%; a process for the production of a siliceous powder which comprises arranging at least two burners in a furnace at angles of 2 to 10° to the central axis of the furnace body and ejecting a raw material siliceous powder from one of the burners and an Al source substance and/or a B source substance from the other(s) of the burners into flame; and resin compositions containing the siliceous powder or an inorganic powder.