发明名称 AN APPARATUS FOR RADIATING HEAT OF LED LAMP
摘要 An apparatus for radiating heat of LED lamp is provided to enhance the cooling efficiency of the LED light by emitting rapidly the heat from the LED light to the lower part of the metal substrate. The heat dissipating metal plate, and the insulating plate(12) and the copper pattern(13) are formed on the metal substrate(1). The LED light(2) is settled in the seating patterned portion(131) of the copper pattern. One or more heat dissipation holes(3) are perpendicularly formed in the seating patterned portion and the heat of the LED light is emitted to the lower part of the metal substrate. The heat dissipating metal plate is comprised of the copper coil. The conductive layer is coated on the inner circumference of the heat dissipation hole to interconnect the seating patterned portion and copper coil.
申请公布号 KR100910746(B1) 申请公布日期 2009.08.05
申请号 KR20090027082 申请日期 2009.03.30
申请人 VODA TECHNOLOGY CO., LTD. 发明人 PARK, SANG KWEON
分类号 F21V29/00;F21S2/00;F21V31/03 主分类号 F21V29/00
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