| 摘要 |
<p>A conductive layer, a laminate using the same, and a manufacturing method thereof are provided to easily remove a copper-tin alloy layer in a following process by preventing thickness increase of the copper-tin alloy layer. A laminate(20) includes a resin layer(4) and a conductive layer(10). The conductive layer includes a copper layer(1) and a copper-tin alloy layer(3). The copper-tin alloy layer is laminated on the copper layer. Thickness of the copper-tin alloy layer is 0.001~0.020um. The copper-tin alloy layer is bonded with the resin layer.</p> |
