SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

A semiconductor device and a manufacturing method thereof are provided to reduce the manufacturing cost and simplify the process by forming a redistribution layer with a wire bonding manner. A semiconductor die(110) has the flat first side, and the second side which is the reverse surface of the first side. At least one bond pad(113) is formed on the first side. A passivation layer(114) is formed on the first side except for the bond pad. The first dielectric layer(120) is formed on the passivation layer in order to expose the bond pad. A redistribution layer(130) comprises the first redistribution layer formed on the bond pad, and the second redistribution layer. The second dielectric layer(140) covers the redistribution layer. The first redistribution layer is charged to the opening of the first dielectric layer. The thickness of first redistribution layer is thicker than the thickness of the second redistribution layer.