发明名称 SOLDER FLUX AND SOLDER PASTE
摘要 A solder flux and a cream solder is provided to improve the thermal stability and to lighten the color by including the polymerized rosin or the hydrogenation polymerized rosin. A solder flux and a cream solder comprises a metal content of less than 50 ppm and the rosin-based compound(A) whose ethanol solution is 1.0muS/cm or less, if it is 20 weight% ethanol solution. The content of the seventeenth group element and the first group element excepting the hydrogen include in the rosin-based compound is 20 ppm or less. The rosin-based compound is obtained by hydrogenating the additive reactant of alpha, beta - unsaturated carboxylic acid(a) and the rosin(b).
申请公布号 KR20090084675(A) 申请公布日期 2009.08.05
申请号 KR20090002802 申请日期 2009.01.13
申请人 ARAKAWA CHEMICAL INDUSTRIES, LTD. 发明人 UEGAITO MANABU;OKAZAKI TAKUMI;SHIMAZU DAISUKE;MIYAMOTO TAKURO
分类号 B23K35/363;C08G8/34;C09D193/04;C09J193/04 主分类号 B23K35/363
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