发明名称 |
SOLDER FLUX AND SOLDER PASTE |
摘要 |
A solder flux and a cream solder is provided to improve the thermal stability and to lighten the color by including the polymerized rosin or the hydrogenation polymerized rosin. A solder flux and a cream solder comprises a metal content of less than 50 ppm and the rosin-based compound(A) whose ethanol solution is 1.0muS/cm or less, if it is 20 weight% ethanol solution. The content of the seventeenth group element and the first group element excepting the hydrogen include in the rosin-based compound is 20 ppm or less. The rosin-based compound is obtained by hydrogenating the additive reactant of alpha, beta - unsaturated carboxylic acid(a) and the rosin(b).
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申请公布号 |
KR20090084675(A) |
申请公布日期 |
2009.08.05 |
申请号 |
KR20090002802 |
申请日期 |
2009.01.13 |
申请人 |
ARAKAWA CHEMICAL INDUSTRIES, LTD. |
发明人 |
UEGAITO MANABU;OKAZAKI TAKUMI;SHIMAZU DAISUKE;MIYAMOTO TAKURO |
分类号 |
B23K35/363;C08G8/34;C09D193/04;C09J193/04 |
主分类号 |
B23K35/363 |
代理机构 |
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主权项 |
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