| 摘要 |
<p>This invention provides an alkali development-type photosensitive heat curing-type resin composition, which can form a film free from a halogen, having a high level of flame retardancy, having excellent low warpage properties after curing, and having excellent plasticity, resolution, soldering heat resistance, chemical resistance and other properties, and a flexible printed wiring board using the composition. The alkali development-type photosensitive heat curing-type resin composition comprises (A) a resin component containing an (meth)acryloyl group and a carboxyl group in one molecule and soluble in a dilute alkali solution, (B) a phosphorus-containing epoxy heat curing resin component, (C) a photopolymerization initiator, (D) an organophosphorus compound, and (E) a diluting agent. The alkali development-type photosensitive heat curing-type resin composition has properties comparable with a conventional photosensitive heat curing-type resin composition using a brominated epoxy resin and a halogenated flame retardant and has an excellent property free from the evolution of hydrogen bromide which has been a problem caused in combustion. ® KIPO & WIPO 2009</p> |
