发明名称 Magnetic random access memory cells having split subdigit lines having cladding layers thereon and methods of fabricating the same
摘要 Magnetic RAM cells have split sub-digit lines surrounded by cladding layers and methods of fabricating the same are provided. The magnetic RAM cells include first and second sub-digit lines formed over a semiconductor substrate. Only a bottom surface and an outer sidewall of the first sub-digit line are covered with a first cladding layer pattern. In addition, only a bottom surface and an outer sidewall of the second sub-digit line are covered with a second cladding layer pattern. The outer sidewall of the first sub-digit line is located distal from the second sub-digit line and the outer sidewall of the second sub-digit line is located distal the first sub-digit line. Methods of fabricating the magnetic RAM cells are also provided.
申请公布号 US7569401(B2) 申请公布日期 2009.08.04
申请号 US20080048082 申请日期 2008.03.13
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK JAE-HYUN;KIM HYEONG-JUN;JEONG WON-CHEOL;JEONG CHANG-WOOK;JEONG HONG-SIK;JEONG GI-TAE
分类号 H01L21/00;H01L21/8246;H01L27/22;H01L29/82;H01L43/08;H01L43/12 主分类号 H01L21/00
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