发明名称 Cooling semiconductor device and manufacturing method thereof
摘要 A semiconductor device includes a semiconductor substrate, a first diffusion region formed in the semiconductor substrate, a semiconductor element formed in the first diffusion region, and a channel formed in the first diffusion region to receive a cooling fluid.
申请公布号 US7569931(B2) 申请公布日期 2009.08.04
申请号 US20060602494 申请日期 2006.11.21
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 OYAMATSU HISATO
分类号 H01L23/34 主分类号 H01L23/34
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