发明名称 Film-forming method
摘要 A film-forming method is provided in which generation of an edge bead can be prevented even in a case where the thickness of a coating solution is large, and includes the steps of applying a coating solution onto a substrate to be treated such that thickness of the coating solution is 20 mum or more, placing the substrate into a heating space defined within an oven unit in which heating devices are provided in upper and lower portions of the heating space, and heating the substrate at a temperature-rising rate of 80 to 120° C./10 min so as to remove a solvent within the coating solution while keeping the substrate in a non-contact state with respect to the heating devices.
申请公布号 US7569253(B2) 申请公布日期 2009.08.04
申请号 US20040997068 申请日期 2004.11.24
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 AOKI TAIICHIRO
分类号 B05D3/02;H01L21/027 主分类号 B05D3/02
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