| 摘要 |
AN OBJECT OF THE PRESENT INVENTION IS TO PROVIDE AN ADHESIVE SHEET FOR PRODUCING A SEMICONDUCTOR DEVICE, WHICH CAN PREVENT THE GENERATION OF OUT GAS COMPONENTS WHICH IS CAUSED BY USING A SILICONE ADHESIVE AND THE LIKE, AND THE OCCURRENCE OF ADHESIVE TRANSFER WHILE MAINTAINING EXCELLENT WIRE BONDING PROPERTIES AND MOLD FLASH PROPERTIES OF THERMOSETTING ADHESIVES WHEN THE ADHESIVE SHEET IS USED FOR PRODUCING A SEMICONDUCTOR DEVICE SUCH AS A QFN, AND CAN THEREBY PREVENT THE PRODUCTION OF DEFECTIVE SEMICONDUCTOR DEVICES, IN ORDER TO ACHIEVE THE OBJECT, THE PRESENT INVENTION PROVIDE AN ADHESIVE SHEET FOR PRODUCING A SEMICONDUCTOR DEVICE WHICH IS DETACHABLY ATTACHED TO A LEAD FRAME OR A WIRING SUBSTRATE, WHEREIN (LIE ADHESIVE SHEET COMPRISES A SUBSTRATE AND AN ADHESIVE LAYER, AND THE ADHESIVE LAYER COMPRISES A THERMOSETTING RESIN COMPONENT (A), A THERMOPLASTIC 15 RESIN COMPONENT (B), AND A FLUORINE BASED ADDITIVE (C). |
