SHEET FOR DIE SORT AND METHOD OF TRANSFERRING CHIP WITH ADHESIVE LAYER

摘要

A sheet for die sort characterized by having a pressure sensitive adhesive layer exposed on a peripheral area of carrier sheet and having a substratum film exposed in a center area inside the peripheral area. There is provided a method of transferring a chip with adhesive layer, characterized by including providing the above sheet for die sort fixed by a frame member by means of the pressure sensitive adhesive layer of the peripheral area; temporarily adhering the adhesive layer of picked up chip to the substratum film exposed in the sheet for die sort; and transferring the sheet for die sort having the chip temporarily adhered by means of the adhesive layer to the subsequent step.