| 摘要 |
<p>THE PRESENT INVENTION PROVIDES AN EPOXY RESIN COMPOSITION FOR PACKAGING A SEMICONDUCTOR DEVICE, CHARACTERIZED IN HAVING IMPROVED MOLD RELEASABILITY DURING A MOLDING PROCESS, CONTINUOUS-MOLDABILITY AND IMPROVED SOLDER RESISTANCE. ACCORDING TO THE PRESENT INVENTION, THERE IS PROVIDED AN EPOXY RESIN COMPOSITION FOR PACKAGING THE SEMICONDUCTOR ELEMENT (101), OBTAINED BY FORMULATING: (A) AN EPOXY RESIN; (B) A PHENOLIC RESIN; (C) A CURING ACCELERATOR; (D) AN INORGANIC FILLER; AND (E) AN OXIDIZED POLYETHYLENE WAX HAVING A DROP POINT WITHIN A RANGE OF FROM 60 TO 140 DEGREE C., AN ACID VALUE WITHIN A RANGE OF FROM 10 TO 100 (Mg KOH/g), A NUMBER AVERAGE MOLECULAR WEIGHT WITHIN A RANGE OF FROM 500 TO 20,000, AND A MEAN PARTICLE SIZE WITHIN A RANGE OF FROM 5 TO 100 UM, WHEREIN AT LEAST ONE OF (A) EPOXY RESIN AND (B) PHENOLIC RESIN IS A NOVOLAC STRUCTURED RESIN HAVING BIPHENYLENE STRUCTURE, AND WHEREIN CONTENT OF (E) OXIDIZED POLYETHYLENE WAX IN EPOXY RESIN COMPOSITION IS WITHIN A RANGE OF FROM 0.01 TO 1% WT.</p> |
