| 摘要 |
PROBLEM TO BE SOLVED: To provide a system for polishing one or more layers of a multi-layer substrate that has a first metal layer and a second layer. SOLUTION: The system includes (i) a liquid carrier, (ii) at least one oxidizing agent, (iii) at least one polishing additive for increasing the rate at which the system polishes at least one layer of the substrate, and (iv) a polishing pad and/or an abrasive. In the system, the polishing additive is selected from the group consisting of pyrophosphate, condensed phosphate, phosphonic acid and their salt, amine, amino alcohol, amide, imine, imino acid, nitrile, nitro, thiol, thioester, thioether, carbothiolic acid, thiocarboxylic acid, thiosalicylic acid, and their mixtures. In addition, a method of polishing a substrate includes steps of contacting a surface of a substrate with the system and polishing at least a portion of the substrate using the system. COPYRIGHT: (C)2009,JPO&INPIT |
