| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for soldering a surface-mounted component, which can prevent a gap between a position at which solder is applied and a position at which a surface-mounted component is mounted on a substrate when the surface-mounted component is reflow-soldered onto the substrate. SOLUTION: A soldering apparatus comprises: a chip holding portion 20 which holds and transfers a chip component 2, and mounts the chip component 2 onto a substrate 4; a spray 30 which sprays a solder paste 3 onto the chip component 2 transferred by the chip holding portion 20; a substrate transporting portion 40 which transports the mounted chip component 2 and the substrate 4 after the chip component 2 is mounted on the substrate 4 by the chip holding portion 20; and a reflow furnace 50 which is positioned on the transporting path of the substrate transporting portion 40 and heats the mounted chip component 2 and the substrate 4. COPYRIGHT: (C)2009,JPO&INPIT |
