| 摘要 |
PROBLEM TO BE SOLVED: To provide a heating nozzle suitable for heating of only a component to be heated, a manufacturing method of a printed board assembly, and a heating method for a component on a printed board. SOLUTION: The heating nozzle comprises a component heating portion 21 made to cover the component 7 on the printed board 6, a supply flow passage 22 supplying a hot blast to the component heating portion 21, and a collection flow passage 23 collecting the hot blast from the component heating portion 21. The flow rate of the collection flow passage 23 is larger than that of the supply flow passage 22. COPYRIGHT: (C)2009,JPO&INPIT |
