| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer end face inspection device capable of detecting a small defect without increasing the cost of a light-receiving optical system even when the position of a wafer varies. SOLUTION: An aperture stop 12 is arranged at the pupil position of an objective lens 11, and an imaging surface 16 is arranged at a conjugated position with the pupil position of the objective lens 11. Light rays emitted from defects C and D are focused at corresponding different positions C' and D' on a field stop, are respectively converted to light rays parallel to each other by a second relay lens 15, and illuminate the imaging surface 16. A pupil image of the objective lens 11 is formed on the imaging surface 16. Thereby, the light rays emitted from the defects C and D illuminate the same position on the imaging surface 16 as shown in the figure. That is to say, even when the position illuminated by illumination light is changed, the position of the imaging surface 16 illuminated by its reflection light is not changed. Even when the position of the wafer 1 illuminated by the illumination light is made different due to warpage of the wafer 1, shift in the radial direction or the like, the position of the imaging surface 16 receiving the light is not changed. COPYRIGHT: (C)2009,JPO&INPIT
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