发明名称 |
COPPER THIN FILM WITH SUPERIOR ADHESIVENESS, AND WIRING AND ELECTRODE FOR LIQUID CRYSTAL DISPLAY COMPRISING THE COPPER THIN FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide a copper thin film for forming wiring and an electrode for a liquid crystal display. SOLUTION: The copper thin film with superior adhesiveness has a component composition containing fluorine of 0.01-5 at.%, and a remainder comprising Cu and unavoidable impurities. The wiring for the liquid crystal display includes the copper thin film, and the electrode for the liquid crystal display with superior adhesiveness includes the copper thin film. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009168937(A) |
申请公布日期 |
2009.07.30 |
申请号 |
JP20080004594 |
申请日期 |
2008.01.11 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
SAKURAI HIDEAKI;HAYASHI YOSHIMASA;CHIBA HAJIME;MORI AKIRA;CHO SHUHIN |
分类号 |
G02F1/1343;C22C9/00;C23C14/34;G09F9/30;H01B5/14 |
主分类号 |
G02F1/1343 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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