| 发明名称 |
RESIN COMPOSITION FOR SEAL-FILLING, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin composition for seal-filling exhibiting good flux activity and excellent in connection reliability. <P>SOLUTION: The resin composition for seal-filling comprises an epoxy resin, a curing agent, and an alcohol compound having at least two alcoholic hydroxyl groups. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
| 申请公布号 |
JP2009167385(A) |
申请公布日期 |
2009.07.30 |
| 申请号 |
JP20080260918 |
申请日期 |
2008.10.07 |
| 申请人 |
HITACHI CHEM CO LTD |
发明人 |
ENOMOTO TETSUYA;NAGAI AKIRA;HONDA KAZUTAKA |
| 分类号 |
C08G59/62;C08K3/00;C08L63/00;H01L23/29;H01L23/31 |
主分类号 |
C08G59/62 |
| 代理机构 |
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| 主权项 |
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| 地址 |
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